Hanmi Semiconductor FY 2025 Annual Report
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Filed: March 12, 2026· period ending December 31, 2025DART

Hanmi Semiconductor annual report for FY 2025, filed with DART (Korea Financial Supervisory Service) on March 12, 2026. This page provides AI-powered English analysis including business overview, management discussion & analysis (MD&A), risk factors, and KIFRS consolidated financial data such as revenue, net income, gross margin, operating margin, and return on equity (ROE).

Hanmi Semiconductor FY 2025 Annual Report Analysis

Business Overview

• Semiconductor equipment revenue KRW 576.7B in FY2025, accounting for 84.6% of total sales
• New "WIDE TC bonder" launch planned to address next-gen HBM structures with wide die bonding capability

Management Discussion & Analysis

• Revenue KRW 576.7B (+3.2% YoY), operating profit KRW 251.4B (-1.6%), net income KRW 214.0B (+40.2%) in FY2025, record-high results
• TC Bonder segment led growth with global 71.2% market share, driven by explosive HBM demand from AI data center investments

Risk Factors

• Largest FX exposure on USD and JPY related export and import transactions, no quantified KRW impact disclosed
• No new derivatives, put-back options, or related contracts entered as of fiscal year 2025 reporting date

Hanmi Semiconductor FY 2025 Key Financial Metrics
DART

Total Assets

KRW 813.3B

▲ +14.4% YoY

Operating Cash Flow

KRW 228.6B

▲ +61.7% YoY

CapEx

KRW 74.6B

▲ +39.4% YoY

Source: KIFRS consolidated financial data from Hanmi Semiconductor annual report on DART. All figures in KRW.

Source: DART (Korea Financial Supervisory Service) · AI summaries generated from the original Korean filing (English output) · Beta: coverage is expanding